Benefits
• Allows testing of RF devices at the wafer-level
• Adaptable to wafer-level probing and singulated device testing for debug and characterization
• Long life and extended maintenance intervals
• Engineering analysis of WLCSP devices or KGD
• Consistently high test yields
• Maximum mechanical operating window to overcome z-stack non-coplanarity
Key Features
• Low loop inductance and high bandwidth
• Device pitches down to 100 µm
• Variety of contact and body materials to optimize performance
• Manual actuation of singulated devices • Low and stable contact resistance
• Individual probe compliance with large mechanical overdrive
