Product Description
thermal CPU silicone cooling compounds paste grease HY510 aluminum copper heat sink LED compound
Ideal for all of the CPU cooler and LED heat sink
these series are optimized for a wide range of bond lines between modern CPUs and high performance heat-sinks or air-cooling solutions.
Specification
|
Items
|
HY510
|
HY520
|
HY530
|
HY550
|
Unit
|
|
Thermal conductivity
|
>1.93
|
>2.3
|
>2.5
|
>2.7
|
W/m-K
|
|
Thermal Impedance
|
< 0.225
|
< 0.214
|
< 0.126
|
< 0.105
|
°C-in2/W
|
|
Gravity
|
>2.4
|
>2.5
|
>2.63
|
>2.76
|
g/cm3
|
|
Viscosity
|
1000
|
1000
|
1000
|
1000
|
No
|
|
Thixotropic Index
|
380±10
|
