The ceramic substrate is based on electronic ceramics and forms a sheet-like material supporting the base for membrane circuit components and integrated Circuit components. Features of ceramic substrate
Ceramic substrate has the main advantages of high temperature resistance, high electrical insulation, low dielectric constant and dielectric loss, large thermal conductivity, good chemical stability, and thermal expansion coefficient similar to that of the component. However, the ceramic substrate is relatively brittle, the substrate size is small and the cost is high.
Classification of ceramic substrates
Classification by the application field of ceramic substrates: HIC (hybrid integrated circuit) ceramic substrates, ceramic substrates for focusing potentiometers, ceramic substrates for laser heating and fixing, chip resistor substrates, network resistor substrates, etc.;
Classification by processing method: molded substrates and laser scribing substrates.
Characteristics of ceramic substrate materials for electronic packaging
Ceramic substrate is a commonly used electronic packaging substrate material. Compared with plastic and metal substrates, ceramic substrate has the following advantages:
1) Good insulation
Generally speaking, the higher substrate resistance, the better reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties;
2) Low dielectric coefficient and good frequency performance
The low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed;
3) Small coefficient of thermal expansion and low thermal mismatch rate
Covalent bond-type compounds generally have high melting point, the higher the melting point, the smaller the thermal expansion coefficient, so the thermal expansion coefficient of ceramic materials is generally small;
4) High thermal conductivity
According to the traditional heat transfer theory, ceramic materials such as BeO, SiC and AlN in the cubic crystal system have theoretical thermal conductivity no less than that of metals.
