AlSiC is ideal for this application because its CTE matches dielectric substrates, Ceramic Ball Grid Array (BGA), Low Temperature Co-fired Ceramic (LTCC) materials, and printed circuit boards, while also has high thermal conductivity. In addition, AlSiC's high strength and hardness also provide protection for integrated circuit devices during assembly. The low density of such materials also improve the reliability of devices under shock or vibration.
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XiAn TRUSUNG Advanced Material Co., Ltd is a new high-tech enterprise which specializes in researching, manufacturing and marketing of advanced materials, especially composite materials.
We mainly committed to the third generation of electronic packaging materials - aluminum silicon carbide R & D, production and sales, according to customer's needs, develope a variety of AlSiC products, microw...
Basic Information
Company Products / Services: alsic igbt baseplate, alsic heat sinks, alsic microwave housing, alsic structural component, etc.
