Laser perforation in general, possible to perforate by pulsed or enlarged focused laser beams are holes sizes from 60-200 microns at density of holes of typically 10-30 holes per cm, holes sequences 100, 000-400, 000 holes per second at a maximal of 16 punctured rows by laser distributed over the material web width with traditional systems or machines. Means in cigarette, tipping, plug wrap, filter, packaging, packs, tear tape, plastic and other material webs. With porosity levels from 100-3, 000 C. U., normally in web widths from 100-500 mm at web speeds of up to 600 m/min, depending on porosity and material consistency in relation to its ability to perforate.
IPM laser cluster material treatment and micro perforation technology
IPM laser cluster material treatment technology LPM-1 is patent granted DE102004001327 and operates with quadruple Co2 carbon or other laser beam inputs up to 4 Kilowatt to a high power twin vacuum level multiplexer to generate up to 200 individual laser output channels, perforation rows across the web material, combines automatic positioned laser perforation heads, focus setting, web speeds up to 400 m/min, web widths up to 2, 000 mm, up to 2, 500, 000 holes per second, jumbo roll-by-roll production, optical inline permeability as perforation line position control, porosity feedback, hi-tech automation level and other features. Each laser micro perforation lines can archive 100-1, 000 C.U.
