1. High density / Fine grain size / High purity / High strength / Low specific resistance / Ease of precise machining
2. Excellent thermal shock resistance to high temperature and oxidation / Good anticorrosion . |
| Application: |
Semiconductor (Monocrystalline Silicon) / Vacuum furnace / Continuous casting / Sealing products / Space & medical industry / Forge moulds EDM.
Heaters / Heat shields /Electronic tube anodes / Melting and sinteringmoulds for Pottery & Electronic Products & Cemented Carbide & Diamond & Aluminium & Copper & Other metals/ Etc. |
| MOLDED | M 1 | M 2 | | Bulk Density MIN（g/cm3） | 1.78 | 1.85 | | Ash Content（PPM） | 500-1000 | 500-1000 | | SHORE HARDNESS | 40 | 45 | ELECTRICAL RESISTVITY
(μ.Ω.m) | ≤12 | ≤12 | FLEXURAL STRENGTH
(MPa) | 30--35 | 35--45 | COMPRESSION STRENGTH
(MPa) | 50--55 | 60--82 | MAX GRAIN SIZE
(μm) | 43μm | 43μm | COEFFICIENT OF THERMAL EXPANSION(100-600℃)
（mm/℃） | 4.5×10-6 | 4.5×10-6 |
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