Equipment overview:
Wafer drying machine has high cleanliness spin rinsedry function. Mainly used for silicon wafer, reticle, solar cells and other similar materials washing drying.
Structure:
Working cavity structure, the largest processing diameter150mm. S is a double cassette structure
system constitution:
The machine adopts double station (or single) stack, product this type structure, each station can be run independently without mutual interference. Can realize automatic process including rotary flushing, drying, nitrogen resistivity monitoring, anti-static control, cavity drying, fault display alarm, system cleaning.
The principle and characteristic of structure
Cleaning technology
High power brushless motor drive
Cleaning work
Rotating nitrogen sealing technology
Deionized water control
ESD control
Earthquake, seismic isolation technology
Speed, counting control technology
Brake control technology
System control technology
Processing software
Particle control performance
Security and protection
Door position monitoring and interlocking
Production technology
