Technical Characteristics (Main configuration)
Diameter of sliced ingots, mm: up to 300mm
Length of sliced ingots, mm: up to 150
Weight of sliced ingots, maximum, kg:11.5
Wire winding speed, m/s: 0.3 - 15
Transversal approach speed, mm/min.:0.07 - 1
Number of wafers from one cycle of cutting (thickness of 0.7mm), pieces:149
Duration of one cycle with a sapphire ingot of 50.8mm in diameter and 150mm in length (resulting in 149 wafers), hours: 2 - 2.5
Parallelism of wafers with a diameter of 50.8mm, micro meters: 20 - 30
Weight of the device, kg: 1310
Watch industry configuration:
One cycle of slicing allows to obtain up to 850 wafers* of 50.8mm in diameter and 0.7mm thick in 2 - 2.5 hours.
*for use in the watch making industry
