Polyimide Coverlay Film ( Yellow/Black )
Halogen free polyimide coverlay film is a kind of high temperature thermosetting epoxy resin coated with polyimide film.the insulating coating is made of release paper as insulation layer and cured by high temperature. The series of materials are widely used in FPC manufacturing for line protection and insulation.
Whole Film Width: 250mm
PI thickness : 0.5mil/1mil (12.5um/25um)
Adhesive thickness:15--25um
Release papers: 130um
Bonding Film (Pure Adhesive Film, White)
Pure adhesive film is made of high adhesive polymer adhesive with a thickness of 12-40um.The adhesive film is three layers of composite structure materials, which are protected by a protective
film and a release paper. The product is served as a complementary product for flexible copperclad laminate , its functions include surface and heat insulation.Pure adhesive film is mainly used in the FPC hot pressing, strengthening, PI, multilayer board bonding, FR4 substrate, soft and hard bonding plate and aluminum based metal plate bonding.
Whole Film Width: 250mm/500mm
Length: 200m
Acrylic Ester Resin Adhesive Thickness : 12--40um
Yancheng Tiandi Insulation Co., Ltd
h t tp://w w w.hsinsulation.com
E mail: hsinsulation(at)aliyun(dot)com
Tel : +86 1396198 6280
Fax : +86 515 69011600
