Backing Material Thickness: 0.10mm
Thickness: 0.18mm/0.20mm
Tensile Strength: ≥380N/25mm
Elongation: ≥3%
Adhesion: ≥8N/25mm
Breakdown Voltage: ≥3Kv
Extented heat-resistance: 260℃
Manufactured from heat resistant fiberglass cloth
with high performance silicon adhesive on both
sides. For masking uses in high temperature
metalizing or plasma-spray coating processes.
An excellent holding tape for components on
circuit boards.
- Inner wrap for coil, transformer and others.