1. An LVDS
The LVDS output interface USES very low voltage fluctuation (about 350mV) to transmit data through the differential data of two PCB lines or a pair of balanced cables. Low voltage differential signal transmission. Put forward a kind of an LVDS output interface, this interface can make the difference balance PCB line or cable transmission signal transmitted at the speed of several hundred megabit per second, therefore, low voltage and low current drive mode to achieve the low noise and low power consumption. At present, the LVDS output interface is widely used in the LCD screen of 17in and above. Its benefits and functions are as follows:
(1) high-speed transmission capacity
(2) low noise/low electromagnetic interference
(3) low power consumption
(4) low voltage
2. The HOTBAR
Hot hot molten solder, will need to connect the two electronic components connected, flat solder (usually FPC or FFC) with a long belt thermal head welding on the circuit boards or connector, so it is called the HotBar. It is different from the thermal sealing process of ACF on the LCD or circuit board. The hot rod is usually used to weld the soft board (FPC/FFC) onto the PCB or connector to make it light, thin, short, small, and effectively reduce the production cost.
3. Gold-plating process
Gold element has a low contact resistance, good conductivity, easy to welding, corrosion resistance is strong, and has a certain wear resistance (refers to solid gold), therefore, electric plating in precision instruments, printed circuit board, integrated circuit, FFC contact, electrical equipment, electric contact is widely used in such aspects.
Due to welding solder formation of intermetallic compounds are Ni (Sn - Ni compound), and Au plating layer is used to protect the Ni layer, therefore, FFC contact before plating need as electroplating with nickel material base (other such as zinc, lead and zinc alloy surface treatment are also made at the bottom of the Ni to material). In addition, the nickel plating layer is mainly as a barrier layer between copper and gold layer, can prevent spread of gold and copper with each other, influence the weldability and service life of the products, at the same time, nickel base layer can greatly increase the mechanical strength of plating layer, color, gloss and color stability.
2. Narrow slit: the laser beam focuses on a small point of light, which causes the focal point to reach a high power density. The material is quickly heated to the degree of gasification, and evaporation forms the hole. With the relative linear movement of the beam and the material, the hole is continuously formed in a narrow slit. The cutting is usually 0.1-0.2mm.
3. Smooth cutting surface: the cutting surface has no burrs, and the surface roughness of the incision is generally controlled in Ral2.5; In A.
4. Speed: cutting speed can reach l0m/min, faster than line cutting.
5. Good cutting quality: no contact cutting, the cutting edge is very small, there is no thermal deformation of the workpiece, completely avoid the collapse of the material in the cutting, and the cutting is not required to be processed twice.
6. No damage to the workpiece: the laser cutting head will not contact the surface of the material and will not scratch the work piece.
2. Die cutting processing
(1) high production efficiency. Maximum speed can reach 350~ 400m/MLN.
(2) good quality of die cutting. Die cutting is the way of wire contact processing. The working pressure small product has good forming stability and the geometrical shape is accurate.
(3) high precision of die cutting. The die cutting machine is equipped with a high precision set and die cutting phase adjustment device, which can obtain quite high die cutting precision.
